Samsung 2000 Annual Report Download - page 36

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Wafers Grow Up
Our new 12-inch wafer
fabrication technology will
allow us to produce over twice
as many chips per wafer as
today’s 8-inch lines, giving us a
major competitive advantage
as the industry moves to
higher-margin 256Mb and
512Mb chips.
Cards With Smarts
Whether it’s facilitating e-
commerce, building customer
loyalty, paying for a phone call
or bus fare, or simply providing
identification, our full-range of
contact and contactless smart
cards are the perfect solution.
Mobile High-Definition
The next generation of
cdma2000 1x and GPRS mobile
phones are making video-on-
the-go a reality. Our new high-
resolution 720 x 240-pixel
poly-silicon reflective TFT-LCD
ensures the viewing
experience is as sharp and
clear as possible.
More Memory To Go
Leaping from 0.18-micron to
0.15-micron technology in just
a six-month period, we
boosted our NAND flash mem-
ory chip capacities from 256Mb
to 512Mb with the world’s
smallest die size to date. And
0.12-micron is just around the
corner.
36
“The networked multimedia future is going to require lots of memory. In
2000, we developed the world’s first 0.10-micron process technology for
the next generation of 4Gb DRAM chips…. This technology will soon be
dramatically increasing per-wafer yields of our 128Mb and 256Mb chips
as we lead the industry in introducing higher-capacity, higher-margin
512Mb and 1Gb chips.”
—Su-Jin Ahn, Senior Engineer, Technology Development Team